Nonvolatile semiconductor memory device and method for manufacturing same
AssigneeKabushiki Kaisha Toshiba
InventorMerii INABA
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AssigneeKabushiki Kaisha Toshiba
InventorMerii INABA
Estimating the term…
According to one embodiment, a stacked body including electrode layers and first insulating layers; first semiconductor members extending in the stacked body; a second semiconductor member including first portions and a second portion, the second semiconductor member being connected commonly to lower ends of the first semiconductor members; a memory film provided between a first electrode layer of the first electrode layers and one of the first semiconductor members; and an insulating film provided between the second semiconductor member and the stacked body. A second electrode layer of the electrode layers is provided on the second portion of the second semiconductor member via the insulating film. A third electrode layer of the electrode layers is provided under the second portion of the second semiconductor member via the insulating film. One of the first insulating layers is provided between the second electrode layer and the third electrode layer.
A nonvolatile semiconductor memory device, comprising:
A method for manufacturing a nonvolatile semiconductor memory device, comprising:
Dependencies are inferred from the claim text.