Non-volatile semiconductor memory device and method for manufacturing same
AssigneeKabushiki Kaisha Toshiba
InventorsTakeshi SONEHARA, Masaru KITO, Takashi SHIMIZU, Yoshihiro AKUTSU
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AssigneeKabushiki Kaisha Toshiba
InventorsTakeshi SONEHARA, Masaru KITO, Takashi SHIMIZU, Yoshihiro AKUTSU
Estimating the term…
According to one embodiment, a stacked body includes electrode layers and first insulating layers alternately stacked. An isolation region extends in the stacked body, the isolation region dividing the stacked body into first regions. First semiconductor members extend in one of the first regions in a stacked direction of the stacked body. A memory film is provided between one of the first semiconductor members and one of the electrode layers. A insulating region extends in the one of the first regions in the stacked direction. A composition of a second region of the one of the electrode layers is different from a composition of a third region of the one of the electrode layers. The second region is in contact with the insulating region, the third region being in contact with the isolation region.
A non-volatile semiconductor memory device, comprising:
A method for manufacturing a non-volatile semiconductor memory device, comprising:
Dependencies are inferred from the claim text.