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US 2016/0079253 A1Published application
Semiconductor memory device
AssigneeKabushiki Kaisha Toshiba
InventorsMikiko MORI, Ryota SUZUKI, Tatsuya KATO, Wataru SAKAMOTO, Fumie KIKUSHIMA
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Abstract
A semiconductor device according to an embodiment includes two semiconductor pillars, a connection member connected between the two semiconductor pillars, and a contact connected to the connection member. There is not a conductive member disposed between the two semiconductor pillars.
Claims21
A semiconductor memory device comprising:
- a first semiconductor pillar extending in a first direction;
- a second semiconductor pillar extending in the first direction, the first semiconductor pillar and the second semiconductor pillar being arranged in a second direction intersecting the first direction;
- two first electrode films extending in a third direction intersecting both of the first direction and the second direction, the two first electrode films being disposed on both outsides of a pair of the first semiconductor pillar and the second semiconductor pillar in the second direction;
- two second electrode films provided between the first semiconductor pillar and one of the first electrode films and between the second semiconductor pillar and another of the first electrode films;
- a first insulating film provided between the first semiconductor pillar and one of the second electrode films;
- a second insulating film provided between the one of the second electrode films and the one of the first electrode films;
- a first connection member being connected in common to an upper end of the first semiconductor pillar and an upper end of the second semiconductor pillar;
- a first contact, a lower end of the first contact being connected to the first connection member;
- and
- a first upper interconnect extending in the second direction and connected to an upper end of the first contact.
7 more elements
A semiconductor memory device comprising:
- a substrate;
- two semiconductor pillars provided on the substrate, extending in a direction away from the substrate, and not having a conductive member disposed therebetween;
- two first electrode films provided on both sides of the two semiconductor pillars in an arrangement direction of the two semiconductor pillars and extending in a direction intersecting an extending direction of the two semiconductor pillars;
- two second electrode films respectively provided between the two semiconductor pillars and the two first electrode films and not in contact with a conductive member;
- an insulating film provided between each of the two semiconductor pillars and each of the two second electrode films;
- and
- a connection member connected between ends of the two semiconductor pillars on a side away from the substrate.
4 more elements
A semiconductor device comprising:
- two semiconductor pillars, not having a conductive member disposed therebetween;
- a connection member connected between the two semiconductor pillars;
- and
- a contact connected to the connection member.
1 more element
Dependencies are inferred from the claim text.