Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

A method of manufacturing a semiconductor device, comprising:

• (a) supplying a first power to a heater while supplying a coolant to a cooling channel without a substrate placed on a substrate support including the heater and the cooling channel where a thermal detector comprising a thermal detecting part disposed lower than an upper surface of the substrate support and higher than lower ends of the heater and the cooling channel is installed;
• (b) placing the substrate on the substrate support;
• and
• (c) supplying a second power to the heater while supplying the coolant to the cooling channel with the substrate placed on the substrate support.

A non-transitory computer-readable recording medium storing a program that causes a computer to perform:

• (a) supplying a first power to a heater while supplying a coolant to a cooling channel without a substrate placed on a substrate support including the heater and the cooling channel where a thermal detector comprising a thermal detecting part disposed lower than an upper surface of the substrate support and higher than lower ends of the heater and the cooling channel is installed;
• (b) placing the substrate on the substrate support;
• and
• (c) supplying a second power to the heater while supplying the coolant to the cooling channel with the substrate placed on the substrate support.