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US 2016/0052108 A1Published application
Positive relief forming of polycrystalline diamond structures and resulting cutting tools
AssigneeUS Synthetic Corporation
InventorDavid P. Miess
Life of this patent
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Abstract
Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.
Claims25
A method of making a polycrystalline diamond (“PCD”) structure, the method comprising:
- forming a mold assembly, the mold assembly including:
- a mold having a cavity therein including at least one flute recess;
- a substrate positioned within the cavity, the substrate having a surface;
- and
- diamond particles positioned within the at least one flute recess;
- and
- subjecting the mold assembly to a high-pressure/high-temperature (“HPHT”) process effective to sinter the diamond particles and bond at least one PCD portion at least partially formed from the diamond particles to an imperforate portion of the surface of the substrate.
4 more elements
A method of making a polycrystalline diamond (“PCD”) structure, the method comprising:
- providing a substrate having a surface;
- positioning at least one diamond material flute volume including diamond particles therein around a portion of the surface of the substrate;
- and
- subjecting the substrate and the at least one diamond material flute volume positioned therearound to a high-pressure/high-temperature (“HPHT”) process effective to sinter the diamond particles and bond at least one PCD portion at least partially formed from the diamond particles to the surface of the substrate.
1 more element
A method of making a polycrystalline diamond compact (“PDC”), the method comprising:
- making a mold having a cavity therein, the cavity including a polycrystalline diamond (“PCD”) body recess and at least one standing feature recess extending from the PCD body recess;
- positioning diamond particles in the PCD body recess;
- positioning a substrate in the cavity;
- positioning diamond particles in the at least one standing feature recess;
- enclosing, in a pressure transmitting medium, the mold including the diamond particles and the substrate;
- and
- subjecting the pressure transmitting medium and the mold including the diamond particles and the substrate therein to a high-pressure/high-temperature (“HPHT”) process effective to sinter the diamond particles and bond PCD portions formed at least partially from the diamond particles to the substrate.
4 more elements
Dependencies are inferred from the claim text.