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US 2015/0319855 A1Published application
Resin composition, and printed circuit board using same
AssigneeLG Innotek Co., Ltd.
InventorsYeo Eun YOON, Myeong Jeong KIM, Sungjin YUN, Sanga JU
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Abstract
According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (Al2O3) groups classified by particle size.
Claims19
A resin composition comprising:
- a resin comprising an epoxy compound represented by the following Formula 1;
- a curing agent comprising diaminodiphenylsulfone;
- and
- an inorganic filler,
- wherein the inorganic filler includes at least two alumina (Al2O3) groups classified according to a particle size:
- wherein R1 to R14 may each independently be selected from the group consisting of H, Cl, Br, F, a C1-C3 alkyl, a C2-C3 alkene, and a C2-C3 alkyne, and
- m and n may each be 1, 2 or 3.
4 more elements
Dependencies are inferred from the claim text.