Oxidation process apparatus, oxidation method, and method for manufacturing electronic device
AssigneeCanon Anelva Corporation
InventorsYoshimitsu Shimane, Takuya Seino
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AssigneeCanon Anelva Corporation
InventorsYoshimitsu Shimane, Takuya Seino
Estimating the term…
An oxidation process apparatus according to one embodiment of the present invention includes: a substrate holder provided in a processing chamber and having a substrate holding surface; a gas introduction unit for introducing an oxygen gas; a cylindrical member; and a substrate holder drive unit for changing relative positions of the substrate holder and the cylindrical member to allow the substrate holding surface and the cylindrical member to form an oxidation process space. The cylindrical member is provided so as to form a gap between the cylindrical member and the substrate holder during formation of the space. The oxygen gas is introduced restrictively into the space. The oxygen gas introduced from the gas introduction unit is evacuated through the gap.
An oxidation process apparatus for performing an oxidation process on a substrate comprising:
An oxidation method for performing an oxidation process on a substrate in a processing chamber provided internally with a substrate holder including a dielectric portion having a substrate holding surface for holding the substrate and a groove portion formed in the substrate holding surface, the method comprising the steps of:
Dependencies are inferred from the claim text.