Device and method for analyzing defects by using heat distribution measurement
AssigneeKorea Basic Science Institute
InventorsKi Soo Chang, Seon Young Ryu, Woo June Choi, Geon Hee Kim
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Abstract
The present invention provides a method for analyzing defects by using heat distribution measurement, comprising: a sample loading unit for loading a sample to check whether or not there is a defect through heat distribution characteristics; a light source for radiating visible light onto the sample; a power supply unit for generating a driving signal in order to periodically heat the sample; a detection unit for detecting reflected light from the surface of the sample; and a signal generator for synchronizing the detection unit with the driving signal of the power supply unit.
Claims12
A defect analysis apparatus using heat distribution measurement, the apparatus comprising:
- a sample loading unit configured to load a sample to determine whether or not there is a defect through heat distribution characteristics;
- a light source configured to radiate light onto the sample;
- a power supply unit configured to generate a driving signal in order to periodically heat the sample at a defect point of the sample;
- a first detection unit configured to detect light reflected from a surface of the sample;
- and
- a signal generator configured to synchronize the first detection unit with the driving signal of the power supply unit.
A defect analysis method using heat distribution measurement, the method comprising:
- radiating visible light onto a sample to determine whether or not there is a defect through heat distribution characteristics;
- supplying a power source for generating a driving signal in order to periodically heat the sample;
- detecting light reflected from a surface of the sample;
- and
- synchronizing a detection unit with the driving signal of a power supply unit.
Dependencies are inferred from the claim text.