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US 2015/0311275 A1Published application
Embedded sheet capacitor
AssigneeQUALCOMM Incorporated
InventorsYoung Kyu Song, Kyu-Pyung Hwang, Dong Wook Kim, Changhan Hobie Yun
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Abstract
A multilayer capacitor is provided that includes a plurality of vias configured to receive interconnects from a die.
Claims30
A multilayer capacitor, comprising:
- one or more layers of a first metal interleaved with one or more layers of a second metal, the one or more layers of the first metal and the one or more layers of the second metal separated by layers of a dielectric;
- a plurality of vias through the multilayer capacitor including a first via and a second via, wherein the first via is configured to receive a first die interconnect and the second via is configured to receive a second die interconnect;
- and
- wherein the one or more layers of the first metal are configured to electrically couple to the first die interconnect through the first via, and the one or more layers of the second metal are configured to electrically couple to the second die interconnect through the second via.
1 more element
A method of forming a multilayer capacitor, comprising:
- interleaving one or more layers of a first metal with one or more layers of a second metal and separating the layers of first metal from the layers of second metal with layers of dielectric;
- forming one or more first via holes capable of coupling one or more first interconnects of a die to the one or more layers of the first metal;
- and
- forming one or more second via holes capable of coupling one or more second interconnects of a die to the one or more layers of the second metal.
1 more element
A multilayer capacitor, comprising:
- means for storing positive and negative charge;
- means for coupling a first interconnect of a die to the positive charge;
- and
- means for coupling a second interconnect of the die to the negative charge.
1 more element
Dependencies are inferred from the claim text.