Chip packaging method and chip package using hydrophobic surface

A chip packaging method comprising:

• forming superhydrophobic surfaces having predetermined sizes on a surface of one of a first chip or a first board and a surface of one of a second chip or a second board, respectively;
• forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively;
• generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively;
• and
• packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.