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US 2015/0311135 A1Published application
Semiconductor device and electronic device
AssigneeFujitsu Limited
InventorShinichiro Uekusa
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes: a substrate; a semiconductor chip mounted over the substrate and having a solder bump coupled by soldering with an electrode over the substrate; and a heating unit for locally generating heat in a corner part within the horizontal plane of the semiconductor chip when an operating temperature of the semiconductor chip is equal to or less than a prescribed temperature.
Claims5
A semiconductor device comprising:
- a substrate;
- a semiconductor chip mounted over the substrate and having a solder bump coupled by soldering with an electrode over the substrate;
- and
- a heating unit for locally generating heat in a corner part within the horizontal plane of the semiconductor chip when an operating temperature of the semiconductor chip is equal to or less than a prescribed temperature.
1 more element
An electronic device comprising:
- a semiconductor device having:
- a substrate;
- a semiconductor chip mounted over the substrate and having a solder bump coupled by soldering with an electrode over the substrate;
- and
- a heating unit for locally generating heat in a corner part within the horizontal plane of the semiconductor chip when an operating temperature of the semiconductor chip is equal to or less than a prescribed temperature.
2 more elements
Dependencies are inferred from the claim text.