Surface plasma modification of porous thin-films to optimize pore filling

A method comprising:

• providing a structure comprising a first layer and a substrate, wherein the first layer overlies the substrate and includes a dielectric material comprising a plurality of pores;
• using a plasma to modify a top portion of the first layer to form a modified top portion of the first layer, wherein the modified top portion has a thickness in the range of about 5 to about 20 nanometers (nm), and wherein the plurality of pores in the first layer remains substantially unsealed after the plasma modification;
• applying a filling material to the modified top portion of the first layer, wherein the filling material comprises a polymer;
• and
• after applying the filling material, heating at least one of the plasma-treated structure and the filling material to enable the filling material to at least partially fill all or substantially all of the plurality of pores disposed throughout the first layer, wherein upon heating said at least one of the plasma-treated structure and the filling material a residual amount of the filling material remains disposed over all of a top surface of the modified top portion of the first layer.