Vacuum adsorption apparatus and a vacuum adsorption method of semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsYong-Ki KIM, Joo-Hoon CHOI
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Abstract
Provided is a vacuum adsorption apparatus and a method of adsorbing a semiconductor package in a vacuum state. The vacuum adsorption apparatus includes a housing having an opening formed on its top surface, a vacuum adsorption unit disposed in the housing, and a stage formed on the opening formed in the housing and including a plurality of holes. A pressure generated from the vacuum adsorption unit is applied to the top surface of the stage through the opening and the plurality of holes.
Claims20
A vacuum adsorption apparatus of a semiconductor package, the vacuum adsorption apparatus comprising:
- a housing having an opening formed on a top surface of the housing;
- a vacuum adsorption unit disposed in the housing;
- and
- a stage formed on the opening formed in the housing and including a plurality of holes,
- wherein a pressure generated from the vacuum adsorption unit is applied to a top surface of the stage through the opening and the plurality of holes.
A vacuum adsorption apparatus of a semiconductor package, the vacuum adsorption apparatus comprising:
- a stage on which a plurality of holes are formed and a semiconductor package is mounted;
- at least one vacuum cartridge positioned under the stage and generating an adsorptive force through a suction hole according to passage of compressed air;
- and
- a housing in which the vacuum cartridge is accommodated and which supports the stage,
- wherein the semiconductor package is fixed on the stage by the adsorptive force of the vacuum cartridge.
A method of adsorbing a semiconductor package, the method comprising:
- providing a stage including a plurality of holes;
- mounting at least one semiconductor package on the stage;
- and
- generating an adsorptive force under the stage to adsorb and fix the semiconductor package.
Dependencies are inferred from the claim text.