Exposure method using control of settling times and methods of manufacturing integrated circuit devices by using the same

A method of manufacturing an integrated circuit (IC) device, the method comprising:

• loading a substrate, with a photoresist layer formed on the substrate, on an exposure stage in an exposure system comprising a beam generator radiating a charged particle beam, main and auxiliary deflectors deflecting the beam radiated from the beam generator to determine a position of a beam shot on the substrate, and the exposure stage on which exposure is performed by using the beam radiated from the beam generator;
• radiating the charged particle beam from the beam generator;
• determining whether a deflection distance from a first position of a latest radiated beam shot to a second position of a subsequent beam shot is within a first distance, which is greater than or equal to a maximum deflection distance to which the auxiliary deflector is configured to deflect the charged particle beam, in a main field area of an exposure target area on the photoresist layer, the main field area having a size determined by the main deflector;
• setting a settling time according to the determined deflection distance so that the settling time for stabilization of the subsequent beam shot is set to a constant minimum value, which is greater than zero, when the determined deflection distance from the first position to the second position is within the first distance;
• deflecting the charged particle beam by using the main deflector based on the set settling time and radiating the beam shot on the second position to expose the photoresist layer;
• and
• developing the exposed photoresist layer to form a photoresist pattern.

An exposure method, comprising:

• radiating a charged particle beam from a beam generator;
• deflecting the charged particle beam using first and second deflectors;
• determining whether a deflection distance from a first position of a latest radiated beam shot to a second position of a subsequent beam shot is within a first distance in a main field area of an exposure target area on a substrate;
• setting a settling time according to the determined deflection distance so that the settling time for stabilization of the subsequent beam shot is set to a constant minimum value, which is greater than zero, when the determined deflection distance is within the first distance;
• and
• using the first deflector, based on the set settling time, to deflect the subsequent beam shot to the second position.