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US 2015/0307994 A1Published application
ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS
AssigneeLam Research Corporation
InventorsEugenijus NORKUS, Loreta TAMASAUSKAITE-TAMASIUNAITE, Aniruddha JOI, Aldona JAGMINIENE, Ina STANKEVICIENE, Yezdi DORDI
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Abstract
A solution for electroless deposition of nickel is provided. A reducing agent of Ti3+ ion is provided to the solution. Ni2+ ions are provided to the solution.
Claims20
A solution for electroless deposition of nickel, comprising:
- a reducing agent of Ti3+ ions;
- and
- Ni2+ ions.
A method for providing an electroless plating of a nickel containing layer, comprising:
- providing a Ti3+ concentrated stock solution;
- providing a Ni2+ concentrated stock solution;
- combining a flow from the Ti3+ concentrated stock solution with a flow from the Ni2+ concentrated stock solution and water to provide a mixed electrolyte for electrolessly depositing Ni;
- and
- exposing a substrate to the mixed electrolyte for electrolessly depositing Ni.
2 more elements
A method for providing an electroless plating of a nickel layer, comprising:
- providing a solution for electroless deposition of nickel, comprising:
- Ti3+ ions;
- and
- Ni2+ ions, wherein a ratio of Ti3+ ions to Ni2+ ions is between 100:1 to 2:1;
- and
- exposing a substrate to the solution for electroless deposition of nickel.
3 more elements
Dependencies are inferred from the claim text.