Ultrasonic probe and manufacturing method thereof

An ultrasonic probe comprising:

• an integrated circuit;
• a capacitive micromachined ultrasonic transducer (CMUT) array bonded to a region of the integrated circuit;
• pads provided on a region of the integrated circuit except for the region to which the cMUT array is bonded;
• an anisotropic conductive film (ACF) provided on the pads;
• and
• a flexible printed circuit board having one end thereof connected to the ACF to output a signal to the integrated circuit.

A method of manufacturing an ultrasonic probe, the method comprising:

• bonding a capacitive micromachined ultrasonic transducer (cMUT) array configured to generate ultrasonic waves to an integrated circuit comprising pads;
• providing an anisotropic conductive film (ACF) on the pads of the integrated circuit;
• and
• connecting one end of a flexible printed circuit board to the ACF by applying at least one of heat and pressure to the ACF.