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US 2015/0189757 A1Published application
Electronic component embedded substrate
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHong-Won KIM, Keun-Yong LEE, Young-Do KWEON
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Abstract
An electronic component embedded substrate is disclosed. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core substrate having a cavity formed therein; a plurality of electronic components embedded in the cavity and arranged in a predetermined format; and a plurality of dielectric spacers interposed in between the plurality of electronic components that are adjacent to one another in the cavity.
Claims6
An electronic component embedded substrate, comprising:
- a core substrate having a cavity formed therein;
- a plurality of electronic components embedded in the cavity and arranged in a predetermined format;
- and
- a plurality of dielectric spacers interposed in between the plurality of electronic components that are adjacent to one another in the cavity.
1 more element
Dependencies are inferred from the claim text.