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US 2015/0189744 A1Published application
Thermosetting resin composition and usage thereof
AssigneeShengyi Technology Co., Ltd.
InventorsXianping ZENG, Nana REN
Life of this patent
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Abstract
The present invention relates to a thermosetting resin composition, wherein the resin composition comprises of: (A) epoxy resin; (B) active ester curing agent; (C) poly-phosphonate ester and/or phosphonate-carbonate copolymer. The prepreg and copper clad laminate prepared with the thermosetting resin composition mentioned above has excellent dielectric performance, wet-heat resistance performance, and a flame resistance performance of UL 94 V-0 level.
Claims20
A thermosetting resin composition comprising of:
- (A) epoxy resin;
- (B) active ester curing agent;
- (C) polyphosphonate ester or/and phosphonate-carbonate copolymer.
Dependencies are inferred from the claim text.