Rigid flexible printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKyung Chul Yu, Ha II Kim, Young Man Kim, Dong Gi An
Life of this patent
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Abstract
Disclosed herein are a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board includes: a flexible substrate having a flexible region and a plurality of rigid regions; a first insulating layer formed in the rigid regions and extended from the rigid regions to cover a portion of the flexible region; and a plurality of build-up layers formed in the first insulating layer of the rigid regions and including a build-up insulating layer and a circuit pattern, wherein at least one of the plurality of build-up layers has a thickness different from those of the other build-up layers.
Claims20
A rigid flexible printed circuit board comprising:
- a flexible substrate having a flexible region and a plurality of rigid regions;
- a first insulating layer formed in the rigid regions and extended from the rigid regions to cover a portion of the flexible region;
- and
- a plurality of build-up layers formed in the first insulating layer of the rigid regions and including a build-up insulating layer and a circuit pattern,
- wherein at least one of the plurality of build-up layers has a thickness different from those of the other build-up layers.
A method of manufacturing a rigid flexible printed circuit board, comprising:
- preparing a flexible substrate having a flexible region and a plurality of rigid regions;
- forming a first insulating layer in the rigid regions so as to be extended from the rigid regions to cover a portion of the flexible region;
- forming a first build-up layer at an upper portion of the flexible region and on the first insulating layer, the first build-up layer including a first build-up insulating layer and a first circuit pattern;
- forming a boundary layer on a first build-up layer of at least one of the plurality of rigid regions;
- forming a second build-up layer on the first build-up layer and the boundary layer, the second build-up layer including a second build-up insulating layer and a second circuit pattern;
- removing the first build-up layer and the second build-up layer of the flexible region;
- and
- removing the second build-up layer formed on the boundary layer.
Dependencies are inferred from the claim text.