Lamination substrate and manufacturing method of the same
AssigneeJVC KENWOOD Corporation
InventorMasato SUGIHARA
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AssigneeJVC KENWOOD Corporation
InventorMasato SUGIHARA
Estimating the term…
A manufacturing method according to an embodiment of the present invention includes: a step of forming a tapered first groove on a surface of a semiconductor wafer; a step of forming a notch groove having a narrow width in a bottom portion of the first groove; a step of laminating the semiconductor wafer to a mother glass substrate using a sealing material; a step of forming a tapered second groove on a back surface of the semiconductor wafer; a step of separating a semiconductor substrate of the semiconductor wafer by cutting the semiconductor wafer from the second groove toward the notch groove; and a step of separating respective counter substrates by cutting the mother glass substrate along a scribe groove.
A manufacturing method for manufacturing a lamination substrate in which a first substrate part and a second substrate part are laminated together using a first mother substrate including a plurality of first substrate parts and a second mother substrate including a plurality of second substrate parts, the manufacturing method comprising:
A lamination substrate comprising:
Dependencies are inferred from the claim text.