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US 2015/0177028 A1Published application
Sensor package and portable terminal having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSun Kyu LEE, Tae Kon KOO, Tae Hoon KIM, Kyu Hwan OH, Seog Moon CHOI
Life of this patent
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Abstract
A sensor package may allow a fluid to flow smoothly to thus increase response characteristics. The sensor package may include: a terminal part; at least one electronic element electrically connected to the terminal part through a bonding wire; and a molded part encapsulating the bonding wire and the electronic element and including a sensing portion partially exposing the electronic element and at least one guide portion guiding an ambient fluid to the sensing portion.
Claims20
A sensor package comprising:
- a terminal part;
- at least one electronic element electrically connected to the terminal part through a bonding wire;
- and
- a molded part encapsulating the bonding wire and the electronic element and including a sensing portion partially exposing the electronic element and at least one guide portion guiding an ambient fluid to the sensing portion.
1 more element
A sensor package comprising:
- a sensor element;
- and
- a molded part encapsulating the sensor element while allowing the sensor element to be partially exposed,
- wherein the molded part includes a recess-type guide portion traversing one surface of the molded part byway of the exposed portion of the sensor element.
1 more element
A portable terminal comprising:
- a sensor package including a molded part encapsulating a sensor element while allowing the sensor element to be partially exposed, the molded part including at least one guide portion traversing one surface of the molded part by way of the exposed portion of the sensor element;
- a board allowing the sensor package to be mounted thereon;
- and
- a case accommodating the board and the sensor package therein and having at least one fluid inlet.
1 more element
Dependencies are inferred from the claim text.