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US 2015/0176993 A1Published application
Mems sensor module and mems sensor package module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsWon Kyu JEUNG, Jung Won LEE, Jong Hyeong SONG
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Abstract
Embodiments of the invention provide a micro electro mechanical system (MEMS) sensor module, including a sensor, a substrate connected to the sensor, and an external board connected to the substrate by a conductive connector. The substrate is provided with a cavity so as to be opposite to the sensor.
Claims10
A micro electro mechanical system (MEMS) sensor module, comprising:
- a sensor;
- a substrate connected to the sensor;
- and
- an external board connected to the substrate by a conductive connector,
- wherein the substrate is provided with a cavity so as to be opposite to the sensor.
2 more elements
A MEMS sensor package module, comprising:
- a sensor;
- an upper cover coupled to one side of the sensor;
- a substrate coupled to the other side of the sensor;
- an application specific integrated circuit (ASIC) coupled to the upper cover;
- an external board connected to the substrate by a conductive connector;
- and
- a mold configured to package the sensor coupled to the substrate,
- wherein the substrate is provided with a cavity so as to be opposite to the sensor.
5 more elements
A MEMS sensor package module, comprising:
- a sensor;
- an upper cover coupled to one side of the sensor;
- a substrate coupled to the other side of the sensor;
- an ASIC coupled to the upper cover;
- an external board connected to the substrate by a conductive connector;
- and
- a mold configured to package the sensor coupled to the substrate,
- wherein the substrate is provided with a first cavity in a stack direction in which the sensor is coupled to the substrate, and a second cavity extended in a direction perpendicular to a direction in which the first cavity is formed.
5 more elements
Dependencies are inferred from the claim text.