US 2015/0176911 A1 · METHOD AND DEVICE FOR COOLING A HEAT GENERATING COMPONENT

Abstract

The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).

Claims8

Dependent claims

An integrated heat spreader, comprising:

at least one heat absorption chamber having a first surface for interfacing with a heat generating component;
at least one heat dissipation chamber having a second surface for interfacing with an external coolant, the second surface being larger than the first surface;
a cooling fluid filling, at least partially, the at least one heat absorption chamber and the at least one heat dissipation chamber;
at least one fluid interconnection oriented to form obtuse angles with respective planes of the first and second surfaces and disposed between the at least one heat absorption chamber and the at least one heat dissipation chamber;
and
at least one pump element for creating a plurality of flow patterns between the at least one heat absorption chamber and the at least one heat dissipation chamber using a forced movement of the cooling fluid.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

14/632,194Filed 26 Feb 2015

Priority

EP 07115962.87 Sep 2007

Published

25 Jun 2015

Term ends

Not estimatedThe source records don’t support an estimate.

Classification14 codes

H05K 7/20281
Using a liquid coolant without phase change in electronic enclosures: thermal management, e.g. liquid flow control
F28D 1/0417
Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids:…
G06F 1/20
Constructional details or arrangements: cooling means
H05K 7/20254
Using a liquid coolant without phase change in electronic enclosures: cold plates transferring heat from heat source to coolant

Method and device for cooling a heat generating component

Life of this patent

Method and device for cooling a heat generating component

Life of this patent

Abstract

Claims8