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US 2015/0176865 A1Published application
Cooling systems and methods using two cooling circuits
AssigneeInertech IP LLC
InventorsGerald McDonnell, Ming Zhang, John Costakis, Earl Keisling
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Abstract
The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.
Claims13
A cooling system comprising:
- a first evaporator coil in thermal communication with an air intake flow to a heat load;
- a first liquid refrigerant distribution unit in thermal communication with the first evaporator coil to form a first fluid circuit;
- a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow to the heat load;
- and
- a second liquid refrigerant distribution unit in thermal communication with the second evaporator coil to form a second fluid circuit;
- a water circuit in thermal communication with the first fluid circuit;
- and
- a compressor circuit in thermal communication with the second fluid circuit and the water circuit.
5 more elements
A cooling system comprising:
- a first evaporator coil in thermal communication with an air intake flow to a heat load;
- a first liquid refrigerant distribution unit in thermal communication with the first evaporator coil to form a first fluid circuit;
- a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow to the heat load;
- a second liquid refrigerant distribution unit in thermal communication with the second evaporator coil to form a second fluid circuit;
- a first cooling circuit in thermal communication with the first fluid circuit;
- and
- a second cooling circuit in thermal communication with the second fluid circuit.
4 more elements
Dependencies are inferred from the claim text.