Electronic component mounting system, electronic component mounting method, and electronic component mounting machine

An electronic component mounting method for mounting a light-emitting element as an electronic component on a board by soldering, said electronic component mounting method comprising:

• placing solder paste on a pair of lands formed on a top surface of the board;
• placing adhesive for fixing of the light-emitting element to the board, on the board between each of the pairs of lands;
• detecting a positional deviation of an emission portion formed in a top surface of the light-emitting element;
• detecting a position of the light-emitting element based on an image of a back surface of the light-emitting element which is obtained in a state in which the top surface of the light-emitting element is absorbed and held by an absorption nozzle of an electronic component mounting machine;
• positioning the light-emitting element with respect to the board by shifting the light-emitting element by its positional deviation by moving the absorption nozzle relative to the board using the detected positional deviation and the detected position of the light-emitting element, to place the emission portion at a prescribed position on the board;
• lowering the absorption nozzle toward the board such that terminals of the light-emitting element contact the solder paste formed on the respective lands and such that a main body of the light-emitting element contacts the adhesive formed on the board;
• curing the adhesive and fixing the light-emitting element to the board;
• and
• performing reflow process to melt solder in the solder paste in a state in which the light-emitting element is fixed to the board by the cured adhesive, and connecting the terminals of the light-emitting element to the respective lands of the board electrically and mechanically.

An electronic component mounting machine which is used in an electronic component mounting system for mounting a light-emitting element as an electronic component on a board by soldering, and which mounts a light-emitting element on the board in which solder paste is formed on a pair of lands formed on a top surface of the board and places adhesive for fixing of the light-emitting elements to the board on the board between the lands, said electronic component mounting machine comprising:

• an emission portion detecting unit which detects a positional deviation of an emission portion formed in a top surface of the light-emitting element;
• a light-emitting element position detecting unit which detects a position of the light-emitting element based on an image of a back surface of the light-emitting element which is obtained in a state in which the top surface of the light-emitting element is absorbed and held by an absorption nozzle;
• a light-emitting element positioning unit which positions the light-emitting element with respect to the board by shifting the light-emitting element by its positional deviation by moving the absorption nozzle relative to the board using the positional deviation detected by the emission portion detecting unit and the position of the light-emitting element detected by the light-emitting element position detecting unit, to place the emission portion at a prescribed position on the board;
• a light-emitting element mounting unit which lowers the absorption nozzle toward the board such that terminals of the light-emitting element contact the solder paste formed on the respective lands and such that a main body of the light-emitting element contacts the adhesive formed on the board.

An electronic component mounting method in which a light-emitting element is mounted as an electronic component on a board, the light-emitting element comprising a main body, a terminal formed on the main body, and an emission portion formed in a top surface of the main body, such that the light-emitting element is temporarily fixed to the board by solder paste and adhesive, the adhesive is cured to form an adhesive portion which fixes the main body of the light-emitting element to the board, and solder in the solder paste is melted to form a solder portion which bonds the terminal of the light-emitting element to a land of the board electrically and mechanically;

• said electronic components mounting method comprising:
• detecting a positional deviation of the emission portion in a top surface of the light-emitting element;
• holding the light-emitting element by an absorption nozzle;
• detecting a position of the light-emitting element in a state in which the light-emitting element is held by the absorption nozzle;
• positioning the emission portion to a prescribed position on the board by moving the absorption nozzle based on the positional deviation of the emission portion and the position of the light-emitting element;
• lowering the absorption nozzle to mount the light-emitting element on the board at a position deviated from the prescribed position on the board by the positional deviation;
• curing the adhesive to form the adhesive portion;
• and
• heating the board which is mounted with the light-emitting element to melt the solder to form the solder portion.