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US 2015/0175408 A1Published application
Method for thin film encapsulation (tfe) of a microelectromechanical system (mems) device and the mems device encapsulated thereof
AssigneeAgency for Science, Technology and Research
InventorsJae-Wung Lee, Jaibir Sharma, Navab Singh
Life of this patent
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Abstract
A method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device, including providing a substrate; forming a MEMS device on the substrate; forming one or more etching channels adjacent to the MEMS device; providing one or more cavities below the MEMS device; and forming one or more cavities above the MEMS device.
Claims18
A method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device, comprising:
- providing a substrate;
- forming a MEMS device on the substrate;
- forming one or more etching channels adjacent to the MEMS device;
- providing one or more cavities below the MEMS device;
- and
- forming one or more cavities above the MEMS device.
3 more elements
A thin film encapsulated microelectromechanical system (MEMS) device comprising:
- a MEMS device formed on a substrate;
- one or more cavities formed above and/or below the MEMS device;
- a cap layer formed over the MEMS device;
- and
- a sealing layer formed over the cap layer;
- wherein one or more etching channels are formed adjacent to the MEMS device and under the cap layer.
3 more elements
Dependencies are inferred from the claim text.