Low Magnetic Chemical Mechanical Polishing Conditioner
AssigneeKinik Company
InventorTian-Yeu WU
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AssigneeKinik Company
InventorTian-Yeu WU
Estimating the term…
The present invention relates to a low magnetic chemical mechanical polishing conditioner, comprising a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles placed on the bonding layer, and the abrasive particles are placed on the substrate by the bonding layer; wherein the abrasive particles are screened into a non-magnetic content and a low magnetic content through a magnetic separation device. Therefore, the abrasive particles used in the low magnetic chemical mechanical polishing conditioner of the present invention are non-magnetic abrasive particles perfectly to avoid influence of polishing performance due to magnetic abrasive particles.
A low magnetic chemical mechanical polishing conditioner, comprising:
Dependencies are inferred from the claim text.