Monitor system and method for semiconductor processes

A method for monitoring a process in a semiconductor processing facility, the method comprising:

• processing a plurality of wafers according to a process;
• determining a wafer-to-wafer interval time for consecutively processed wafers of the plurality of wafers, wherein the wafer-to-wafer interval time is an amount of time between an occurrence of a processing event for the consecutively processed wafers;
• determining a set of control limits for the process based on the determined wafer-to-wafer interval times, the set of control limits including i) an upper control limit for the wafer-to-wafer interval time, and ii) a lower control limit for the wafer-to-wafer interval time;
• and
• processing second wafers according to the process, wherein a problem in the processing of the second wafers is identified based on the set of control limits, and wherein the problem is identified as the second wafers are being processed.

A monitor system for a semiconductor processing facility, the monitor system comprising:

• semiconductor processing equipment configured to process a plurality of wafers according to a process;
• a controller configured to collect data on the processing of the plurality of wafers, wherein the controller collects, for each wafer of the plurality of wafers:
• a first data indicating that a processing event has occurred, and
• a second data including a time associated with the processing event;
• an event database configured to store the first data and the second data, the event database being further configured to store a wafer-to-wafer interval time for consecutively processed wafers of the plurality of wafers, wherein the wafer-to-wafer interval time is an amount of time between an occurrence of the processing event for the consecutively processed wafers, and wherein the wafer-to-wafer interval time is determined based on the second data;
• and
• a statistical process control (SPC) system configured to determine a set of control limits for the process based on the wafer-to-wafer interval times, the set of control limits defining a range of acceptable values for the wafer-to-wafer interval time,
• wherein a problem in the processing of second wafers according to the process is identified based on the set of control limits, the problem being identified in a real time manner as the second wafers are being processed.