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AssigneeHitachi Kokusai Electric Inc.
InventorsKatsuyoshi HAMANO, Atsushi UMEKAWA, Takuya JODA, Akinori ISHII, Masahisa OKUNO
Estimating the term…
Heating within a plane of a substrate may be uniform while a thermal budget is decreased. A substrate processing apparatus includes a process chamber configured to accommodate a substrate; a substrate mounting unit installed in the process chamber and configured to have the substrate placed thereon; an electromagnetic wave supply unit configured to supply an electromagnetic wave to the substrate placed on the substrate mounting unit; and a choke groove formed on a side surface of the substrate mounting unit.
A substrate processing apparatus comprising:
A method of manufacturing a semiconductor device, comprising:
A non-transitory computer-readable recording medium causing a computer to perform:
Dependencies are inferred from the claim text.