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US 2015/0147486 A1Published application
Photosintering of micron-sized copper particles
AssigneePEN Inc.
InventorsOvadia Abed, Valerie Kaye Ginsberg, James P. Novak
Life of this patent
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Abstract
Micron-sized metal particles in an ink or paste composition are deposited onto a substrate and then photosimered. The substrate may comprise a polymeric material. The polymeric substrate may have a coefficient of thermal expansion greater than two times the coefficient of thermal expansion of the photosimered ink or paste composition.
Claims20
A method for making a conductive film comprising:
- depositing an ink or paste composition comprising micron-sized metal particles onto a polymeric substrate having a melting point less than 200° C., wherein the micron-sized metal particles in the ink or paste composition have an average particle size greater than one micron;
- and
- photosintering the ink or paste composition after being deposited onto the substrate.
A method for making a conductive film, comprising:
- depositing an ink or paste composition comprising micron-sized metal particles onto a polymeric substrate having a melting point less than 200° C. and a thermal conductivity greater than 0.1 W/mK, wherein the micron-sized metal particles in the ink or paste composition have an average particle size greater than two microns;
- and
- photosintering the ink or paste composition after being deposited onto the substrate, wherein during the photosintering of the ink or paste composition, some heat generated in the micron-sized metal particles as a result of the photosintering is transferred from the micron-sized metal particles into the polymeric substrate to reduce ramping up of the heat within the micron-sized metal particles, which also results in a partial melting of a surface of the polymeric substrate so that some of the micron-sized metal particles physically embed into the polymeric substrate surface.
Dependencies are inferred from the claim text.