Plating method, plating apparatus, and storage medium

A plating apparatus of performing an electroless plating process to a recess formed in a substrate, the plating apparatus comprising:

• a substrate holding unit configured to hold the substrate in which the recess is formed;
• and
• a plating unit configured to supply a plating liquid to the substrate and form a plating layer having a specific function on an inner surface of the recess,
• wherein the plating unit includes a first plating unit configured to supply a first plating liquid to the substrate;
• and a second plating unit configured to supply a second plating liquid to the substrate after the first plating liquid is supplied, and
• a concentration of an additive contained in the first plating liquid is different from a concentration of an additive contained in the second plating liquid.

A computer-readable storage medium having stored thereon computer-executable instructions that, in response to execution, cause a plating apparatus to perform a plating method of performing an electroless plating process to a recess formed in a substrate,

• wherein the plating method comprises:
• a loading process of loading the substrate in which the recess is formed into a casing;
• and
• a plating process of supplying a plating liquid to the substrate and forming a plating layer having a specific function on an inner surface of the recess,
• wherein the plating process includes a first plating process of supplying a first plating liquid to the substrate and forming a first plating layer;
• and a second plating process of supplying a second plating liquid to the substrate and forming a second plating layer after the first plating process, and
• a concentration of an additive contained in the first plating liquid is different from a concentration of an additive contained in the second plating liquid.