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US 2015/0147463 A1Published application
Dielectric materials
OwnerChristopher D. Gilmore, Lujia BU +5inventors
InventorsChristopher D. Gilmore, Lujia BU, Peng-Wei CHUANG, Cecilia Waithera KIARIE, Young Seok KIM, Kathleen M. O'Connell, Stefan J. CAPORALE
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Abstract
Certain polyphenylene oligomers having good solvent strip resistance, low coefficient of thermal expansion and good adhesion to a variety of surfaces are useful as thin-film dielectric materials in electronics applications.
Claims10
An oligomer comprising as polymerized units a first monomer comprising two cyclopentadienone moieties and a second monomer having the formula
- wherein a is the number of R groups and is an integer from 0 to 4;
- each R is independently chosen from (C1-C4)alkyl, halo(C1-C4)alkyl, (C1-C4)alkoxy, (C i-C4)aralkyl, (C6-C10)aryl, or substituted (C6-C10)aryl;
- wherein the first monomer and the second monomer are present in a mole ratio of from 1:1.001 to 1:1.95;
- and wherein the oligomer comprises terminal ethynyl moieties.
1 more element
Dependencies are inferred from the claim text.