Methods and media for averaging contours of wafer feature edges
AssigneeGlobalfoundries Inc.
InventorFrancois Weisbuch
Life of this patent
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Abstract
A method of determining an average contour of a patterned feature on a wafer includes providing a reference contour corresponding to the patterned feature on the wafer, providing a plurality of images of the patterned feature, extracting from the plurality of images a plurality of extracted contours that represent the patterned feature, eliminating flyers from the plurality of extracted contours, and generating the average contour of the patterned feature based on the extracted contours remaining after elimination of the flyers.
Claims20
A method of determining an average contour of a patterned feature of a wafer, the method comprising:
- providing a reference contour corresponding to the patterned feature on the wafer;
- providing a plurality of images of the patterned feature;
- extracting from the plurality of images a plurality of extracted contours that represent the patterned feature;
- eliminating flyers from the plurality of extracted contours;
- and
- generating the average contour of the patterned feature based on the extracted contours remaining after elimination of the flyers.
A method of inspecting a patterned feature on a wafer, the method comprising:
- determining an average contour of the patterned feature on the wafer, determining comprising:
- providing a reference contour corresponding to the patterned feature on the wafer;
- providing a plurality of images of the patterned feature;
- extracting from the plurality of images a plurality of extracted contours that represent the patterned feature;
- eliminating flyers from the plurality of extracted contours;
- and
- generating the average contour of the patterned feature based on the extracted contours remaining after elimination of the flyers;
- and
- inspecting the average contour of the patterned feature.
A non-transitory computer readable medium storing control logic for operating a computer system, the control logic including control logic instructions for:
- providing a reference contour corresponding to a patterned feature on a wafer;
- providing a plurality of images of the patterned feature;
- extracting from the plurality of images a plurality of extracted contours that represent the patterned feature;
- eliminating flyers from the plurality of extracted contours;
- and
- generating the average contour of the patterned feature based on the extracted contours remaining after elimination of the flyers.
20-22. (canceled)
Dependencies are inferred from the claim text.