Semiconductor device and a method for forming a semiconductor device
AssigneeInfineon Technologies AG
InventorChee Yang Ng
Life of this patent
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Abstract
A semiconductor device includes a microphone module implemented on a first semiconductor die and a signal processing module implemented on a second semiconductor die. The microphone module includes a movable microphone element arranged at a main side of the first semiconductor die and the second semiconductor die is mounted to the main side of the first semiconductor die.
Claims20
A semiconductor device comprising:
- a microphone module implemented on a first semiconductor die, wherein the microphone module comprises a moveable microphone element arranged at a main side of the first semiconductor die;
- and
- a signal processing module implemented on a second, different semiconductor die, wherein the second semiconductor die is mounted to the main side of the first semiconductor die.
A semiconductor device comprising:
- a microphone module implemented on a first semiconductor die;
- a signal processing module implemented on a second, different semiconductor die, wherein the second semiconductor die is mounted to a first side of the first semiconductor die;
- and
- a lead frame mounted to a second side of the first semiconductor die.
A method for forming a semiconductor device comprising a microphone module implemented on a first semiconductor die and a signal processing module implemented on a second semiconductor die, wherein the microphone module comprises a moveable microphone element arranged at a main side of the first semiconductor die, wherein the method comprises mounting the second semiconductor die to the main side of the first semiconductor die.
Dependencies are inferred from the claim text.