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US 2015/0146887 A1Published application
Microphone on printed circuit board (pcb)
AssigneeInvenSense, Inc.
InventorsAleksey S. Khenkin, Anthony D. Minervini
Life of this patent
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Abstract
A MEMS device includes a MEM-CMOS module having a CMOS chip and a MEMS chip. The MEMS chip includes a port exposed to the environment. The MEMS device further includes a printed circuit board (PCB) with an aperture, wherein the MEMS-CMOS module is directly mounted on the PCB.
Claims28
A MEMS device comprising:
- a MEMS-CMOS module including a CMOS chip and a MEMS chip, wherein
- the MEMS chip includes a port exposed to the environment;
- and
- a printed circuit board (PCB) with an aperture, wherein the MEMS-CMOS module is directly mounted on the PCB.
1 more element
A method of fabricating a MEMS device comprising:
- forming a MEM-CMOS module with a MEMS chip on top of a CMOS chip;
- mounting the MEMS-CMOS module directly onto a printed circuit board (PCB) with an aperture;
- and
- electrically connecting the MEMS-CMOS module to the PCB.
1 more element
A method of fabricating a MEMS device comprising:
- mounting a MEM-CMOS module with a CMOS substrate directly on top of a printed circuit board (PCB);
- mounting a MEMS chip directly on top of the PCB;
- electrically connecting the CMOS chip to the MEMS chip;
- and
- electrically connecting the CMOS chip to the PCB.
2 more elements
Dependencies are inferred from the claim text.