Memory device and method of controlling memory device
AssigneeKabushiki Kaisha Toshiba
InventorKenichi MUROOKA
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Abstract
According to one embodiment, a memory device includes a plurality of global column lines arranged in parallel and extending in a first direction; a plurality of row lines extending in a second direction which is perpendicular to the first direction; a plurality of column lines in a two-dimensional arrangement, which extend in a third direction which is perpendicular to the first direction and the second direction; and a memory cell array including a plurality of memory cells arranged at intersections between the row lines and the column lines.
Claims19
A memory device comprising:
- a plurality of global column lines arranged in parallel and extending in a first direction;
- a plurality of row lines extending in a second direction which is perpendicular to the first direction;
- a plurality of column lines in a two-dimensional arrangement, which extend in a third direction which is perpendicular to the first direction and the second direction;
- a memory cell array including a plurality of memory cells each including a resistance change material, the memory cells being arranged at intersections between the row lines and the column lines;
- a plurality of sheet selectors disposed between the global column lines and the column lines;
- and
- a controller configured to control the global column lines, the row lines, the column lines, the memory cells and the sheet selectors,
- the plurality of sheet selectors comprising:
- a first transistor including a channel region, a first insulation layer formed on a first side surface of the channel region, and a first select gate line extending in the second direction and formed on the first insulation layer in the first direction;
- and
- a second transistor including a channel region, a second insulation layer formed on a second side surface of the channel region, which is opposed to the first side surface in the first direction, and a second select gate line extending in the second direction and formed on the second insulation layer in the first direction, and
- the controller being configured, at a time of storing or easing data in the memory cell array, to execute:
- select a global column line, a row line and a select gate line in order to select the memory cells;
- apply a select row line voltage to a selected row line of the plurality of row lines;
- apply a non-select row line voltage to a non-selected row line of the plurality of row lines;
- apply a select global column line voltage to a selected global column line of the plurality of global column lines;
- apply a first non-select global column line voltage to a non-selected global column line of the plurality of global column lines;
- apply a non-select selector voltage to the first and second select gate lines;
- apply a first select selector voltage to the first select gate line of the first transistor of a selected sheet selector of the plurality of sheet selectors;
- and
- apply, after passage of a first time after the applying of the first select selector voltage, a second select selector voltage to the second select gate line of the selected sheet selector.
A method of controlling a memory device, the device comprising:
- a plurality of global column lines arranged in parallel and extending in a first direction;
- a plurality of row lines extending in a second direction which is perpendicular to the first direction;
- a plurality of column lines in a two-dimensional arrangement, which extend in a third direction which is perpendicular to the first direction and the second direction;
- a memory cell array including a plurality of memory cells each including a resistance change material, the memory cells being disposed at junction planes of intersections between the row lines and the column lines;
- and
- a plurality of sheet selectors disposed between the global column lines and the column lines,
- the sheet selectors comprising:
- a first transistor including a channel region, a first insulation layer formed on a first side surface of the channel region, and a first select gate line extending in the second direction and formed on the first insulation layer in the first direction;
- and
- a second transistor including a channel region, a second insulation layer formed on a second side surface of the channel region, which is opposed to the first side surface in the first direction, and a second select gate line extending in the second direction and formed on the second insulation layer in the first direction,
- the method comprising:
- selecting a global column line, a row line and a select gate line in order to select the memory cells;
- applying a select row line voltage to a selected row line;
- applying a non-select row line voltage to a non-selected row line;
- applying a select global column line voltage to a selected global column line;
- applying a non-select global column line voltage to a non-selected global column line;
- applying a non-select selector voltage to the first and second select gate lines which are not selected;
- applying a first select selector voltage to the first select gate line of the first and second transistors of a selected sheet selector of the plurality of sheet selectors, the selected sheet selector being connected to a selected column line;
- and
- applying, after passage of a first time after the applying of the select selector voltage, a second select selector voltage to the second select gate line of the selected sheet selector.
Dependencies are inferred from the claim text.