Grounding part, electronic device, imaging device, and grounding part production method

An imaging device comprising:

• a circuit board having an electronic component thereon;
• and
• a grounding member having a reference potential,
• wherein
• the circuit board is grounded to the grounding member by a grounding part,
• the grounding part includes
• a first connecting component made of an electrically conductive material and connected to a circuit board having an electronic component thereon;
• and
• a second connecting component made of an electrically conductive material and connected to the first connecting component and a grounding member,
• the first connecting component includes
• a substrate connecting part connected to the circuit board, and
• a second-connecting-component connecting part connected to the second connecting component, and
• the second connecting component includes
• a first-connecting-component connecting part connected to the first connecting component, and
• a grounding-part connecting part connected to the grounding member.

A method of producing a grounding part, the grounding part including a first connecting component made of an electrically conductive material and connected to a circuit board having an electronic component thereon, and a second connecting component made of an electrically conductive material and connected to the first connecting component and a grounding member,

• the method comprising:
• forming a substrate connecting part connected to the circuit board;
• forming a second-connecting-component connecting part connected to the second connecting component;
• forming a first-connecting-component connecting part connected to the first connecting component;
• and
• forming a grounding-part connecting part connected to the grounding member.