Package substrate, method of manufacturing the same, and power module package using package substrate

A method of manufacturing a package substrate, the method comprising:

• forming a cavity on one surface of a substrate;
• forming an insulating layer on one surface of the substrate;
• and
• forming a circuit pattern on the insulating layer,
• wherein:
• the cavity is formed to form an electronic device adhesive portion and a protrusion portion;
• and
• the protrusion portion includes an upper surface portion as a connection member adhesive portion, and a first side surface portion and a second side surface portion that are inclined to converge towards the upper surface portion.

A power module package comprising:

• a package substrate including a substrate including an electronic device adhesive portion and a protrusion portion formed on one surface thereof, an insulating layer formed on one surface of the substrate, and a circuit pattern formed on the insulating layer, the protrusion portion including an upper surface portion as a connection member adhesive portion, and a first side surface portion and a second side surface portion that are inclined to converge towards the upper surface portion;
• a first lead frame adhered onto a circuit pattern on an upper surface portion of the protrusion portion;
• a first electronic device mounted on the circuit pattern on the electronic device adhesive portion;
• a second lead frame facing the first lead frame and spaced apart from the substrate by a predetermined distance;
• and
• a second electronic device mounted on the second lead frame.