Multilayer ceramic capacitor including at least one slot

A method comprising:

• forming a first conductive layer corresponding to a first terminal of a two-terminal multilayer ceramic capacitor (MLCC), wherein the first conductive layer includes at least one slot;
• forming a first insulating layer above the first conductive layer, wherein a first side of the first insulating layer is adjacent to the first conductive layer;
• and
• forming a second conductive layer corresponding to a second terminal of the two-terminal MLCC above the first insulating layer, wherein the second conductive layer includes at least one slot, and wherein a second side of the first insulating layer that is opposite to the first side is adjacent to the second conductive layer.

An apparatus comprising:

• a two-terminal multilayer ceramic capacitor (MLCC) comprising:
• first means for conducting, wherein the first means for conducting corresponds to a first terminal of the two-terminal MLCC and wherein the first means of for conducting includes at least one slot;
• second means for conducting, wherein the second means for conducting corresponds to a second terminal of the two-terminal MLCC and wherein the second means of for conducting includes at least one slot;
• and
• means for insulating, wherein the means for insulating is disposed between the first means for conducting and the second means for conducting.

A non-transitory computer-readable medium comprising instructions that, when executed by a processor, cause the processor to:

• initiate formation of a first conductive layer corresponding to a first terminal of a two-terminal multilayer ceramic capacitor (MLCC), wherein the first conductive layer includes at least one slot;
• initiate formation of a first insulating layer above the first conductive layer, wherein a first side of the first insulating layer is adjacent to the first conductive layer;
• and
• initiate formation of a second conductive layer corresponding to a second terminal of the two-terminal MLCC above the first insulating layer, wherein the second conductive layer includes at least one slot, and wherein a second side of the first insulating layer that is opposite to the first side is adjacent to the second conductive layer.