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US 2015/0146339 A1Published application
Pad design for electrostatic chuck surface
AssigneeApplied Materials, Inc.
InventorsGovinda RAJ, Cheng-Hsiung TSAI, Robert T. HIRAHARA, Kadthala R. NARENDRNATH, Manjunatha KOPPA, Ross MARSHALL
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Abstract
Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.
Claims20
A mask for coating an electrostatic chuck, comprising:
- a flat member comprising a material selected from the group consisting of silicon nitride, aluminum nitride, silicon carbide, and zirconium oxide, wherein the mask has a serpentine opening at a central region of the mask.
An electrostatic chuck, comprising:
- a chuck surface;
- and
- a pattern of bumps on the chuck surface, the pattern comprising:
- a serpentine bump at a central region of the chuck surface;
- and
- a first group of bumps with three sub-groups spaced at equal angular distance around a periphery of the chuck.
3 more elements
A material composition for a surface of an electrostatic chuck assembly, comprising:
- a first layer of a sputtering target material;
- a second layer above the first layer, comprising:
- a first concentration of carbon atoms, and
- a first concentration of silicon atoms;
- and
- a third layer above the second layer, comprising:
- an increased concentration of carbon atoms, and
- a decreased concentration of silicon atoms.
5 more elements
Dependencies are inferred from the claim text.