Controlling adhesives between substrates and carriers
AssigneeHewlett-Packard Development Company, L.P.
InventorsRio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
Life of this patent
Estimating the term…
Loading patent…
AssigneeHewlett-Packard Development Company, L.P.
InventorsRio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
Estimating the term…
Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
A method for controlling adhesives between substrates and carriers, comprising:
A print head with a controlled adhesive between a substrate and a carrier, comprising:
A system with a controlled adhesive between a substrate and a carrier, comprising,
Dependencies are inferred from the claim text.