Pressure sensing and control for semiconductor wafer probing

A method of implementing a wafer probing system, the method comprising:

• positioning a semiconductor wafer mounted on a motor driven wafer chuck to a preset position to initiate contact between the wafer and a probe card assembly having a plurality of individual probe structures, with each probe structure configured with a pressure sensing unit integrated therewith;
• and
• upon detection of contact between at least one probe structure and a surface of the wafer via a pressure sensing unit of the at least one probe structure, engaging a plurality of piezoelectric driver units in response to feedback from the pressure sensing unit so as to perform fine adjustment of the at least one probe structure and ensure contact between the at least one probe structure and a surface of the wafer.