Apparatus and method for providing a seal around a perimeter of a bi-material enclosure

A method, comprising;

• co-molding a seal to a first material form a sub-assembly in which the first material is securely adhered to the seal, wherein the seal is designed to collapse in a specific direction during an injection molding process;
• over-molding a resin flow of a second material on the sub-assembly during the injection molding process,
• compressing the seal in the specific direction during the injection molding process;
• responsive to the compressing, producing a consistent wetting at least at one desired perimeter joint between the seal and the over-molded second material;
• and
• forming a bi-material enclosure,
• wherein the first material and the second material are dissimilar materials with different thermal expansion qualities.

A bi-material enclosure of an electronic device, comprising;

• a sub-assembly including a seal securely co-molded to a first material, wherein the seal is designed to collapse in a specific direction during an injection molding process;
• and
• a second material configured to be over-molded on the sub-assembly during the injection molding process and compress the seal in the specific direction to produce a consistent wetting at least at one desired perimeter joint between the seal and the over-molded second material,
• wherein the first material and the second material are dissimilar materials with different thermal expansion qualities.