Semiconductor Device Packaging

A method of laser machining a layer stack comprising an encapsulation body containing a plurality of semiconductor chips, the method comprising:

• labeling semiconductor device packages to be separated out of the layer stack by laser marking;
• and
• removing at least one trace of at least one of a metal layer and an organic layer covering the encapsulation body by laser ablation, wherein the at least one trace corresponds to an encapsulation body separation line,
• wherein the laser marking and the laser ablation are performed at the same work station.

A semiconductor device package, comprising:

• an encapsulant having a first main surface and a second main surface;
• a semiconductor chip at least partly embedded in the encapsulant;
• and
• at least one of a metal layer and an organic layer extending over the first main surface of the encapsulant,
• wherein, at a corner region of the semiconductor device package, the first main surface of the encapsulant is free of the at least one of the metal layer and the organic layer.