Multiple Bond Via Arrays of Different Wire Heights on a Same Substrate

An apparatus, comprising:

• a substrate;
• a first bond via array with first wires extending from a surface of the substrate;
• a second bond via array with second wires extending from the surface of the substrate;
• wherein the first bond via array and the second bond via array are external to the substrate;
• wherein the first bond via array is disposed at least partially within the second bond via array;
• wherein the first wires of the first bond via array are of a first height;
• and
• wherein the second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.