Substrate-to-Carrier Adhesion Without Mechanical Adhesion Between Abutting Surfaces Thereof
AssigneeInvensas Corporation
InventorsBelgacem Haba, Ilyas Mohammed
Life of this patent
Estimating the term…
Abstract
Wafer to carrier adhesion without mechanical adhesion for formation of an IC. In such formation, an apparatus has a bottom surface of a substrate abutting a top surface of a support platform without adhesive therebetween. A material is disposed around the substrate and on the top surface of the support platform. The material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface.
Claims20
An apparatus, comprising:
- a substrate;
- a support platform;
- wherein a bottom surface of the substrate abuts a top surface of the support platform without adhesive therebetween;
- a material disposed around the substrate and on the top surface of the support platform;
- wherein the material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface.
An apparatus, comprising:
- a substrate;
- a support platform;
- a membrane;
- wherein the membrane is disposed at least between a bottom surface of the substrate and a top surface of the support platform without adhesive therebetween for attachment to the bottom surface of the substrate;
- a material disposed around the substrate and on the top surface of the membrane;
- wherein the material seals an interface as between the bottom surface of the substrate and the top surface of the membrane to retain abutment of the bottom surface to the membrane and the support platform in combination.
A method, comprising:
- placing a substrate on a top surface of a support platform;
- wherein a bottom surface of the substrate abuts the top surface of the support platform after placement without adhesive between the bottom surface and the top surface;
- depositing a material over and around the substrate and on the top surface of the support platform;
- wherein the material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface without adhesive therebetween;
- removing an upper portion of the material;
- thinning the substrate including removing more of the material;
- processing the substrate including back-end-of-line processing;
- and
- dicing the substrate to provide dies.
Dependencies are inferred from the claim text.