Emiconductor device and manufacturing method thereof

A semiconductor package, comprising:

• a die including a first surface and a second surface;
• a carrier including a third surface bonded with a plurality of first conductive bumps on the second surface of the die and a fourth surface disposed with a plurality of second conductive bumps;
• a molding including a protruded portion disposed on a periphery portion of the first surface and surrounding the plurality of first conductive bumps and the die;
• a thermal interface material (TIM) disposed on the first surface of the die and surrounded by the protruded portion of the molding;
• and
• a heat dissipator attached with the thermal interface material (TIM) and disposed over the molding.

A method of manufacturing a semiconductor device, comprising:

• providing a carrier;
• flip bonding a die on the carrier;
• disposing a rubber material on a first surface of the die and within the first surface of the die;
• and
• forming a molding surrounding the rubber material and covering the carrier.