Thermally Enhanced Package with Lid Heat Spreader

A semiconductor package, comprising:

• a substrate having first and second surfaces;
• a die having first and second surfaces, where the first surface of the die is attached to the first surface of the substrate;
• a thermally conductive interface layer located on the second surface of the die;
• and
• a heat spreader lid having a first surface and an exposed heat dissipation surface, the heat spreader lid comprising one or more recess openings formed in the first surface to define a recessed pedestal structure and a peripheral extension structure, where the recessed pedestal structure is positioned for direct attachment to the thermally conductive interface layer, and where the recessed pedestal structure and peripheral extension structure define a mold compound cavity in which compression molded compound material is located to seal the substrate and heat spreader lid.

A method of making a semiconductor package, comprising:

• attaching a plurality of integrated circuit die to a molded array package array substrate array to enable electrical connection between each integrated circuit die and conductors in the substrate array;
• attaching a thermally conductive interface layer on an exposed surface of each of the plurality of integrated circuit die;
• providing a heat spreader lid array formed with an unlaminated thermally conductive layer having a first surface and a second heat dissipation surface, the heat spreader lid array comprising a plurality of recess openings formed in the first surface to define:
• a plurality of recessed pedestals aligned with the plurality of integrated circuit die,
• a corresponding plurality of mold compound cavity openings formed around the plurality of recessed pedestals,
• one or more singulation recess openings formed at least partially through the heat spreader lid array around each of the plurality of recessed pedestals, and
• one or more perimeter reservoir regions formed in the heat spreader lid array to be connected through one or more openings to the plurality of mold compound cavity openings;
• attaching a molding tape layer to the second heat dissipation surface of the heat spreader lid array;
• partially filling the plurality of mold compound cavity openings of the heat spreader lid array with a mold compound material in a fluid state;
• clamping the substrate array to the heat spreader lid array so that the thermally conductive interface layer on each integrated circuit die makes direct contact with a corresponding recessed pedestals from the heat spreader lid array, thereby partially displacing the mold compound material into one or more perimeter reservoir regions without covering the second heat dissipation surface of the heat spreader lid array with mold compound material;
• and
• curing the mold compound material in the plurality of mold compound cavity openings to encapsulate the plurality of integrated circuit die and to seal the substrate array to the heat spreader lid array, resulting in an array of molded packages, each having a portion of the substrate array exposed on a first side and a portion of the heat spreader array exposed on a second side.