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US 2015/0145112 A1Published application
Electronic Component
AssigneeInfineon Technologies AG
InventorRalf Otremba
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Abstract
In an embodiment, an electronic component includes a housing, a die pad having a first surface and a second surface opposing the first surface, a first high voltage semiconductor device arranged on the first surface of the die pad, a further semiconductor device arranged on the second surface of the die pad and a conductive connection between the first high voltage semiconductor device and the further semiconductor device. The conductive connection is surrounded by the housing and includes a portion arranged adjacent the die pad.
Claims20
An electronic component, comprising:
- a housing;
- a die pad having a first surface and a second surface opposing the first surface;
- a first high voltage semiconductor device arranged on the first surface of the die pad;
- a further semiconductor device arranged on the second surface of the die pad;
- and
- a conductive connection between the first high voltage semiconductor device and the further semiconductor device surrounded by the housing and comprising a portion arranged adjacent the die pad.
3 more elements
Dependencies are inferred from the claim text.