Electronic component with electronic chip between redistribution structure and mounting structure

A method of manufacturing an electronic component, the method comprising:

• mounting an electronic chip on an electrically conductive mounting structure;
• arranging an electrically conductive redistribution structure on the electronic chip;
• electrically coupling a periphery connection structure to the redistribution structure and configuring the periphery connection structure for connecting the electronic component to an electronic periphery;
• configuring at least one of the electrically conductive mounting structure and the electrically conductive redistribution structure with electrically conductive inserts in an electrically insulating matrix.

An arrangement, the arrangement comprising:

• a plurality of interconnected electrically conductive mounting structures;
• a plurality of electronic chips, each of which being mounted on an assigned one of the mounting structures;
• a plurality of interconnected electrically conductive redistribution structures, each of which being mounted on an assigned one of the electronic chips;
• wherein at least one of the electrically conductive mounting structures and the electrically conductive redistribution structures comprise electrically conductive inserts in an electrically insulating matrix.